Newegg has the IVY's now.

[bg]

Boy they look like they are going to be something. I use AMD almost
exclusively, but one of the Intel quads sure look good..

http://www.newegg.com/Product/ProductList.aspx?Submit=ENE&N=100007671%2050001157%20600315409&IsNodeId=1&name=Ivy%20Bridge

[JDay]

I'm not so sure about Ivy Bridge. They run hotter than Sandy Bridge and have about the same performance.

[Dubious_Beans]

I'm not so sure about Ivy Bridge. They run hotter than Sandy Bridge and have about the same performance.

What? Run hotter?

Says who?

How do they run hotter while using less power than Sandy Bridge?

[Merc1138]

What? Run hotter?

Says who?

How do they run hotter while using less power than Sandy Bridge?

Smaller surface area to dissipate heat, that's how.

However, the people complaining about temperature issues have noticed a few things. IB doesn't seem to have an issue getting to 4.4ghz while still being at 1.1v or under. It's also possible that temperatures are being calculated incorrectly since some applications seem to be counting the thermal junction point at 105C instead of the 99/100 that IB is supposed to be(which might account for some higher temp readings, and this wouldn't be the first time it's happened). Also, SB used fluxless solder to attach the heatspreader to the core, IB uses regular thermal paste between the heatspreader and the core, which has a higher thermal resistance as well(but shouldn't make more than a few degrees difference), but that's based off of pre-releease samples sent to press prior to the product launch so this may change over time.

http://hardforum.com/forumdisplay.php?f=5

You can find tons of info about it. Basically SB was very... "refined" and can hit higher overclocks on basic air cooling, but people have reported well over 6ghz with IB going to extreme methods(LN2, phase change, dry ice, etc.).

[Dubious_Beans]

Also, SB used fluxless solder to attach the heatspreader to the core, IB uses regular thermal paste between the heatspreader and the core

Ah. They wrecked the Junction to Case thermal resistance.
Sigh... That's too bad.

[Merc1138]

Ah. They wrecked the Junction to Case thermal resistance.
Sigh... That's too bad.

Read what I posted again, they did change it but that alone doesn't explain the difference. There is much more to it than that. Tjunction being assumed wrong by applications reading the temperature values would display temps being higher than they really are. Even removing the IHS and cooling the core directly has not shown a significant drop in temperature, compared to leaving the IHS in place with Intel's default TIM in place.

http://www.tweaktown.com/news/23815/ivy_bridge_s_heat_problems_persist_even_with_the_removal_of_its_ihs/index.html

Even then, this is only an actual problem for those doing some serious overclocking/overvolting.

[Dubious_Beans]

Read what I posted again, they did change it but that alone doesn't explain the difference. There is much more to it than that. Tjunction being assumed wrong by applications reading the temperature values would display temps being higher than they really are. Even removing the IHS and cooling the core directly has not shown a significant drop in temperature, compared to leaving the IHS in place with Intel's default TIM in place.

Got it.

Oh well, I'm afraid I'm gonna miss out on the Ivy Bridge experience anyway.
I just finished building a pair of SB systems for the wife & I and by the time I'm ready to upgrade again Skylake will probably be out.

[Merc1138]

Going from SB to IB is pointless, unless you're desperate for PCIe 3.0.

[JDay]

What? Run hotter?

Says who?

How do they run hotter while using less power than Sandy Bridge?

Says Intel and everyone who has reviewed them. The die size is smaller so there is less surface area to dissipate the heat.

http://www.theinquirer.net/inquirer/news/2171299/intel-admits-ivy-bridge-chips-run-hotter

Intel launched its Ivy Bridge line last week with the firm touting its 22nm process node as its biggest achievement. Intel's smaller process node along with changes in the interface material between the die and the heat spreader have led to reports of higher temperatures.